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Preliminary engineering drawing of the \acrshort{dune} \acrshort{nd}\AC{} component.
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Preliminary engineering drawing of \AC{} in the \acrshort{dune} \acrshort{nd}.
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\num{4 x 5} modules with the longer dimension in beam direction.
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Service volumes make up the remainder of the \SI{5 x 5}{\metre} \acrshort{lar} bath.
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Service volumes make up the remainder of the \SI{5 x 5}{\metre} \acrshort{lar} bath contained within a low-radiation-length foam-insulated membrane cryostat.
The \larpix{} electronics described in Section~\ref{sec:studies_pixel-electronics} are designed to be capable of handling the data rates and power consumption expected for a \SI{3}{\milli\metre} pixel pitch \AC{} \gls{nd} component.
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Therefore, a sufficient spatial resolution from a physics point of view is provided while keeping the power and data rate demands on the readout electronics under control.
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Inspired by the design of the \dune{} \SI{35}{\tonne} prototype at \gls{fail}~\cite{dune4} the \lar{} bath is held in a foam-insulated membrane cryostat.
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Inspired by the design of the \dune{} \SI{35}{\tonne} prototype at \gls{fail}~\cite{dune4} the \lar{} bath is contained within a foam-insulated membrane cryostat.
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The outer support structure is a \SI{0.3}{\metre} thick steel-reinforced concrete layer, followed by a \SI{0.4}{\metre} thick polyurethane foam layer for thermal insulation.
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Inside of this is a \SI{2}{\milli\metre} thick stainless steel membrane sealing the \lar{} bath from the environment.
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There are several other support layers, all of which with a thickness of $\sim{\SI{1}{\milli\metre}}$, with a more detailed description in~\cite{dune4}.
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