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Merge tag 'thermal-v5.8-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal updates from Daniel Lezcano: - Add the hwmon support on the i.MX SC (Anson Huang) - Thermal framework cleanups (self-encapsulation, pointless stubs, private structures) (Daniel Lezcano) - Use the PM QoS frequency changes for the devfreq cooling device (Matthias Kaehlcke) - Remove duplicate error messages from platform_get_irq() error handling (Markus Elfring) - Add support for the bandgap sensors (Keerthy) - Statically initialize .get_mode/.set_mode ops (Andrzej Pietrasiewicz) - Add Renesas R-Car maintainer entry (Niklas Söderlund) - Fix error checking after calling ti_bandgap_get_sensor_data() for the TI SoC thermal (Sudip Mukherjee) - Add latency constraint for the idle injection, the DT binding and the change the registering function (Daniel Lezcano) - Convert the thermal framework binding to the Yaml schema (Amit Kucheria) - Replace zero-length array with flexible-array on i.MX 8MM (Gustavo A. R. Silva) - Thermal framework cleanups (alphabetic order for heads, replace module.h by export.h, make file naming consistent) (Amit Kucheria) - Merge tsens-common into the tsens driver (Amit Kucheria) - Fix platform dependency for the Qoriq driver (Geert Uytterhoeven) - Clean up the rcar_thermal_update_temp() function in the rcar thermal driver (Niklas Söderlund) - Fix the TMSAR register for the TMUv2 on the Qoriq platform (Yuantian Tang) - Export GDDV, OEM vendor variables, and don't require IDSP for the int340x thermal driver - trivial conflicts fixed (Matthew Garrett) * tag 'thermal-v5.8-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (48 commits) thermal/int340x_thermal: Don't require IDSP to exist thermal/int340x_thermal: Export OEM vendor variables thermal/int340x_thermal: Export GDDV thermal: qoriq: Update the settings for TMUv2 thermal: rcar_thermal: Clean up rcar_thermal_update_temp() thermal: qoriq: Add platform dependencies drivers: thermal: tsens: Merge tsens-common.c into tsens.c thermal/of: Rename of-thermal.c thermal/governors: Prefix all source files with gov_ thermal/drivers/user_space: Sort headers alphabetically thermal/drivers/of-thermal: Sort headers alphabetically thermal/drivers/cpufreq_cooling: Replace module.h with export.h thermal/drivers/cpufreq_cooling: Sort headers alphabetically thermal/drivers/clock_cooling: Include export.h thermal/drivers/clock_cooling: Sort headers alphabetically thermal/drivers/thermal_hwmon: Include export.h thermal/drivers/thermal_hwmon: Sort headers alphabetically thermal/drivers/thermal_helpers: Include export.h thermal/drivers/thermal_helpers: Sort headers alphabetically thermal/core: Replace module.h with export.h ...
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‎Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml

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# SPDX-License-Identifier: (GPL-2.0)
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# Copyright 2020 Linaro Ltd.
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%YAML 1.2
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---
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$id: http://devicetree.org/schemas/thermal/thermal-cooling-devices.yaml#
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$schema: http://devicetree.org/meta-schemas/core.yaml#
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title: Thermal cooling device binding
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maintainers:
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- Amit Kucheria <[email protected]>
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description: |
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Thermal management is achieved in devicetree by describing the sensor hardware
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and the software abstraction of cooling devices and thermal zones required to
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take appropriate action to mitigate thermal overload.
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The following node types are used to completely describe a thermal management
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system in devicetree:
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- thermal-sensor: device that measures temperature, has SoC-specific bindings
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- cooling-device: device used to dissipate heat either passively or actively
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- thermal-zones: a container of the following node types used to describe all
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thermal data for the platform
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This binding describes the cooling devices.
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There are essentially two ways to provide control on power dissipation:
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- Passive cooling: by means of regulating device performance. A typical
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passive cooling mechanism is a CPU that has dynamic voltage and frequency
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scaling (DVFS), and uses lower frequencies as cooling states.
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- Active cooling: by means of activating devices in order to remove the
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dissipated heat, e.g. regulating fan speeds.
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Any cooling device has a range of cooling states (i.e. different levels of
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heat dissipation). They also have a way to determine the state of cooling in
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which the device is. For example, a fan's cooling states correspond to the
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different fan speeds possible. Cooling states are referred to by single
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unsigned integers, where larger numbers mean greater heat dissipation. The
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precise set of cooling states associated with a device should be defined in
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a particular device's binding.
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select: true
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properties:
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"#cooling-cells":
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description:
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Must be 2, in order to specify minimum and maximum cooling state used in
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the cooling-maps reference. The first cell is the minimum cooling state
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and the second cell is the maximum cooling state requested.
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const: 2
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examples:
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- |
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#include <dt-bindings/interrupt-controller/arm-gic.h>
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#include <dt-bindings/thermal/thermal.h>
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// Example 1: Cpufreq cooling device on CPU0
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cpus {
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#address-cells = <2>;
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#size-cells = <0>;
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CPU0: cpu@0 {
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device_type = "cpu";
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compatible = "qcom,kryo385";
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reg = <0x0 0x0>;
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enable-method = "psci";
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cpu-idle-states = <&LITTLE_CPU_SLEEP_0
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&LITTLE_CPU_SLEEP_1
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&CLUSTER_SLEEP_0>;
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capacity-dmips-mhz = <607>;
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dynamic-power-coefficient = <100>;
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qcom,freq-domain = <&cpufreq_hw 0>;
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#cooling-cells = <2>;
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next-level-cache = <&L2_0>;
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L2_0: l2-cache {
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compatible = "cache";
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next-level-cache = <&L3_0>;
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L3_0: l3-cache {
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compatible = "cache";
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};
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};
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};
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/* ... */
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};
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/* ... */
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thermal-zones {
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cpu0-thermal {
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polling-delay-passive = <250>;
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polling-delay = <1000>;
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thermal-sensors = <&tsens0 1>;
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trips {
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cpu0_alert0: trip-point0 {
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temperature = <90000>;
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hysteresis = <2000>;
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type = "passive";
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};
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};
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cooling-maps {
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map0 {
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trip = <&cpu0_alert0>;
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/* Corresponds to 1000MHz in OPP table */
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cooling-device = <&CPU0 5 5>;
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};
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};
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};
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/* ... */
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};
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...

‎Documentation/devicetree/bindings/thermal/thermal-idle.yaml

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# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause)
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# Copyright 2020 Linaro Ltd.
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%YAML 1.2
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---
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$id: http://devicetree.org/schemas/thermal/thermal-idle.yaml#
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$schema: http://devicetree.org/meta-schemas/core.yaml#
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title: Thermal idle cooling device binding
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maintainers:
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- Daniel Lezcano <[email protected]>
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description: |
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The thermal idle cooling device allows the system to passively
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mitigate the temperature on the device by injecting idle cycles,
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forcing it to cool down.
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This binding describes the thermal idle node.
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properties:
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$nodename:
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const: thermal-idle
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description: |
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A thermal-idle node describes the idle cooling device properties to
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cool down efficiently the attached thermal zone.
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'#cooling-cells':
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const: 2
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description: |
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Must be 2, in order to specify minimum and maximum cooling state used in
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the cooling-maps reference. The first cell is the minimum cooling state
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and the second cell is the maximum cooling state requested.
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duration-us:
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description: |
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The idle duration in microsecond the device should cool down.
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exit-latency-us:
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description: |
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The exit latency constraint in microsecond for the injected
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idle state for the device. It is the latency constraint to
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apply when selecting an idle state from among all the present
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ones.
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required:
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- '#cooling-cells'
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examples:
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- |
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#include <dt-bindings/thermal/thermal.h>
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// Example: Combining idle cooling device on big CPUs with cpufreq cooling device
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cpus {
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#address-cells = <2>;
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#size-cells = <0>;
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/* ... */
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cpu_b0: cpu@100 {
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device_type = "cpu";
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compatible = "arm,cortex-a72";
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reg = <0x0 0x100>;
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enable-method = "psci";
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capacity-dmips-mhz = <1024>;
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dynamic-power-coefficient = <436>;
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#cooling-cells = <2>; /* min followed by max */
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cpu-idle-states = <&CPU_SLEEP &CLUSTER_SLEEP>;
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thermal-idle {
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#cooling-cells = <2>;
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duration-us = <10000>;
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exit-latency-us = <500>;
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};
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};
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cpu_b1: cpu@101 {
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device_type = "cpu";
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compatible = "arm,cortex-a72";
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reg = <0x0 0x101>;
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enable-method = "psci";
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capacity-dmips-mhz = <1024>;
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dynamic-power-coefficient = <436>;
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#cooling-cells = <2>; /* min followed by max */
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cpu-idle-states = <&CPU_SLEEP &CLUSTER_SLEEP>;
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thermal-idle {
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#cooling-cells = <2>;
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duration-us = <10000>;
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exit-latency-us = <500>;
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};
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};
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/* ... */
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};
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/* ... */
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thermal_zones {
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cpu_thermal: cpu {
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polling-delay-passive = <100>;
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polling-delay = <1000>;
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/* ... */
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trips {
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cpu_alert0: cpu_alert0 {
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temperature = <65000>;
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hysteresis = <2000>;
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type = "passive";
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};
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cpu_alert1: cpu_alert1 {
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temperature = <70000>;
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hysteresis = <2000>;
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type = "passive";
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};
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cpu_alert2: cpu_alert2 {
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temperature = <75000>;
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hysteresis = <2000>;
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type = "passive";
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};
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cpu_crit: cpu_crit {
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temperature = <95000>;
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hysteresis = <2000>;
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type = "critical";
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};
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};
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cooling-maps {
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map0 {
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trip = <&cpu_alert1>;
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cooling-device = <&{/cpus/cpu@100/thermal-idle} 0 15 >,
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<&{/cpus/cpu@101/thermal-idle} 0 15>;
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};
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map1 {
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trip = <&cpu_alert2>;
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cooling-device =
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<&cpu_b0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
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<&cpu_b1 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
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};
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};
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};
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};

‎Documentation/devicetree/bindings/thermal/thermal-sensor.yaml

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# SPDX-License-Identifier: (GPL-2.0)
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# Copyright 2020 Linaro Ltd.
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%YAML 1.2
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---
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$id: http://devicetree.org/schemas/thermal/thermal-sensor.yaml#
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$schema: http://devicetree.org/meta-schemas/core.yaml#
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title: Thermal sensor binding
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maintainers:
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- Amit Kucheria <[email protected]>
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description: |
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Thermal management is achieved in devicetree by describing the sensor hardware
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and the software abstraction of thermal zones required to take appropriate
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action to mitigate thermal overloads.
17+
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The following node types are used to completely describe a thermal management
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system in devicetree:
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- thermal-sensor: device that measures temperature, has SoC-specific bindings
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- cooling-device: device used to dissipate heat either passively or actively
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- thermal-zones: a container of the following node types used to describe all
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thermal data for the platform
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This binding describes the thermal-sensor.
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Thermal sensor devices provide temperature sensing capabilities on thermal
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zones. Typical devices are I2C ADC converters and bandgaps. Thermal sensor
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devices may control one or more internal sensors.
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properties:
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"#thermal-sensor-cells":
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description:
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Used to uniquely identify a thermal sensor instance within an IC. Will be
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0 on sensor nodes with only a single sensor and at least 1 on nodes
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containing several internal sensors.
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enum: [0, 1]
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examples:
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- |
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#include <dt-bindings/interrupt-controller/arm-gic.h>
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// Example 1: SDM845 TSENS
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soc: soc@0 {
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#address-cells = <2>;
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#size-cells = <2>;
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/* ... */
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tsens0: thermal-sensor@c263000 {
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compatible = "qcom,sdm845-tsens", "qcom,tsens-v2";
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reg = <0 0x0c263000 0 0x1ff>, /* TM */
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<0 0x0c222000 0 0x1ff>; /* SROT */
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#qcom,sensors = <13>;
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interrupts = <GIC_SPI 506 IRQ_TYPE_LEVEL_HIGH>,
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<GIC_SPI 508 IRQ_TYPE_LEVEL_HIGH>;
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interrupt-names = "uplow", "critical";
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#thermal-sensor-cells = <1>;
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};
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tsens1: thermal-sensor@c265000 {
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compatible = "qcom,sdm845-tsens", "qcom,tsens-v2";
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reg = <0 0x0c265000 0 0x1ff>, /* TM */
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<0 0x0c223000 0 0x1ff>; /* SROT */
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#qcom,sensors = <8>;
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interrupts = <GIC_SPI 507 IRQ_TYPE_LEVEL_HIGH>,
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<GIC_SPI 509 IRQ_TYPE_LEVEL_HIGH>;
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interrupt-names = "uplow", "critical";
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#thermal-sensor-cells = <1>;
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};
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};
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...

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