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Description
We’re developing an open LGA socket (LGA-Z1) for modular ARMv9 CPUs. This issue covers creating the initial KiCad footprint based on our estimated pin ranges (1,100–2,200) and physical layout constraints.
Tasks:
Define socket outline and pad pitch
Create matching KiCad footprint and symbol
Export DXF or image for visual review
Push files into /hardware/socket/ folder in repo
Requirements:
LGA pads must accommodate CPU thermal constraints
Support alignment holes / mechanical guides if possible
Follow existing open socket documentation best practices (like LGA1700, AM5)
Resources:
Project README
Contact: aegirontechnologies@gmail.com
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help wantedExtra attention is neededExtra attention is needed