You signed in with another tab or window. Reload to refresh your session.You signed out in another tab or window. Reload to refresh your session.You switched accounts on another tab or window. Reload to refresh your session.Dismiss alert
ASoC: SOF: Intel: start splitting top-level from common parts
The existing code relies on the 'HDA_COMMON' module and namespace. We
need to start splitting top-level parts from the low-level ones,
otherwise we will not be able to reuse the low-level parts DMA support
for SoundWire/BPT.
In the end the dependencies will be:
+----------------------------------------------+
| |
| v
sof-pci-intel-xxx --> sof-intel-hda ------------> sof-hda-common
| ^
| |
+-> soundwire_intel --> sof_hda_sdw_bpt
This patch adds the initial split between the sof-pci-intel-xxx
modules and the common parts, in a follow-up patch we will further
split the HDA_COMMON parts
Since the PCI modules are not all independent, i.e. the CNL parts are
also used in JSL and TGL, additional Kconfig and namespace modules
were added.
Signed-off-by: Pierre-Louis Bossart <[email protected]>
Reviewed-by: Bard Liao <[email protected]>
Reviewed-by: Ranjani Sridharan <[email protected]>
Link: https://lore.kernel.org/r/[email protected]
Signed-off-by: Mark Brown <[email protected]>
0 commit comments