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1 | 1 | \section{Resistive Micromegas} |
2 | 2 | \label{chap:TPC_sec:micromegas} |
3 | | -Most recent update: 2020-05-24\\ |
| 3 | +Most recent update: 2020-07-24\\ |
4 | 4 | Contact person: Paul Colas (email: paul.colas@cea.fr)\\ |
5 | 5 |
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6 | 6 | \subsection{Introduction} |
7 | 7 | First Micromegas prototypes were built with a micro-mesh stretched on a frame, and kept on top of |
8 | | -a segmented anode at a fixed distance of \SI{50}{\micro\meter}. The gap is defined by spacers manufactured |
| 8 | +a segmented anode at a fixed distance of \SI{50}{\micro \meter}. The gap is defined by spacers manufactured |
9 | 9 | by photo-lithographic techniques. Early tests confirmed that, due to ``hodoscope effect'' a resolution |
10 | | -down to \SI{100}{\micro\meter} could not be reached \cite{Arogancia:2007pt}. This triggered studies with charge spreading |
| 10 | +down to \SI{100}{\micro \meter} could not be reached \cite{Arogancia:2007pt}. This triggered studies with charge spreading |
11 | 11 | developed at Carleton University~\cite{Dixit:2003qg}. |
12 | 12 | The first resistive material was an AlSi CERMET deposited on a Mylar foil and glued at |
13 | 13 | \SI{90}{\degreeCelsius} with layer of melting polymer~\cite{2007NIMPA.581..254D}. Later on, a more robust resistive material was |
@@ -60,9 +60,33 @@ \subsection{Recent Milestones} |
60 | 60 |
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61 | 61 | In 2018, the endplate was equipped with 4 new modules with a DLC anode. Also, a new scheme was applied for the amplification High Voltage : the anode is set at a positive high voltage, and the Micromegas mesh is set to ground, as the surrounding supports. This allows a better field homogeneity near the module boundary and mitigates the distortions. In addition, this improved the operability of the detector : in case of breakdown of one module, its surface remains at ground, leaving the endplate equipotential. |
62 | 62 |
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63 | | -\subsection{Engineering Challenges} |
| 63 | +The dE/dx resolution is shown in Fig.\ref{fig:fig440} as a function of track length. For the ILC TPC size, it is 5\%. |
| 64 | +\begin{figure} |
| 65 | +\centering |
| 66 | +\includegraphics[width=90mm]{Tracker/TPC_Bonn/plots/fig200116_dEdx_modCanvSize.eps} |
| 67 | +\caption{The dE/dx resolution as a function of the track length for \SI{5}{GeV} electrons. The red line is a power law.} |
| 68 | +\label{fig:fig440} |
| 69 | +\end{figure} |
| 70 | +The point resolution in the r$\phi$ and z coordinates are shown in Fig.\ref{fig:fig421}. The r$\phi$ resolution reaches \SI{65}{\micro\meter} at zero drift distance, and increases as expected with z, due to electron diffusion during the drift. |
| 71 | + |
| 72 | +\begin{figure} |
| 73 | + \begin{minipage}{0.5\hsize} |
| 74 | + \begin{center} |
| 75 | + \includegraphics[width=76mm]{Tracker/TPC_Bonn/plots/fig200411_resoX_mod3_24Nov_B1_Ed230Vcm_Ed140Vcm} |
| 76 | + \end{center} |
| 77 | + \end{minipage} |
| 78 | + \begin{minipage}{0.5\hsize} |
| 79 | + \begin{center} |
| 80 | + \includegraphics[width=76mm]{Tracker/TPC_Bonn/plots/fig200411_resoZ_mod3_24Nov_B1_Ed230Vcm_Ed140Vcm} |
| 81 | + \end{center} |
| 82 | + \end{minipage} |
| 83 | +\caption{The distributions of the spatial and z resolution as a function of the measured drift length, in black for a drift field of \SI{230}{\volt\per\centi\meter} and in blue for \SI{140}{\volt\per\centi\meter} (average over the 24 pad-rows of a module).} |
| 84 | +\label{fig:fig421} |
| 85 | +\end{figure} |
| 86 | + |
64 | 87 |
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65 | | -The requirements on the mechanical precision and flatness of the modules are very demanding to keep the systematics on the distortions below 10-20 microns. |
| 88 | +\subsection{Engineering Challenges} |
| 89 | +The requirements on the mechanical precision and flatness of the modules are very demanding to keep the systematical errors on the sagitta from distortions below 10-20 microns. |
66 | 90 |
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67 | 91 | The adaptation of a gating device at a few cm from the end-plate, or integrated to each module, is a |
68 | 92 | difficult engineering challenge if a minimal degradation of the performances is to be obtained. |
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