Merge branch 'LION1CELL02A' of https://github.com/mlab-modules/LION1CELL02 into LION1CELL02A

Author: Tomik

doc/gen/LION1CELL02-schematic.pdf

@@ -26,10 +26,10 @@ Track width: N/A mm (N/A mils)
 
 - By design rules: 0.0 mm (0 mils)
 
-Drill: N/A mm (N/A mils)
+Drill: 0.6 mm (24 mils)
 
 - Vias: N/A mm (N/A mils) [Design: 0.4 mm (16 mils)]
-- Pads: N/A mm (N/A mils)
+- Pads: 0.6 mm (24 mils)
 - The above values are real drill sizes, they add 0.1 mm (4 mils) to plated holes (PTH)
 
 Via: N/A/N/A mm (N/A/N/A mils)
@@ -39,19 +39,19 @@ Via: N/A/N/A mm (N/A/N/A mils)
 - Buried/blind via: yes
 - Total: 0 (thru: 0 buried/blind: 0 micro: 0)
 
-Outer Annular Ring: N/A mm (N/A mils)
+Outer Annular Ring: 0.15 mm (6 mils)
 
-- By design rules: N/A mm (N/A mils)
+- By design rules: 0.15 mm (6 mils)
 
 Eurocircuits class: 4A
-- Using min drill N/A mm for an OAR of N/A mm
+- Using min drill 0.6 mm for an OAR of 0.15 mm
 
 
 # General stats
 
 Components count: (SMD/THT)
 
-- Top: 0/0 (NONE)
+- Top: 80/7 (SMD + THT)
 - Bottom: 0/0 (NONE)
 
 Defined tracks:
@@ -68,12 +68,27 @@ Used vias:
 
 Holes (excluding vias):
 
+- 0.65 mm (26 mils) (2)
+- 1.0 mm (39 mils) (10)
+- 1.6 mm (63 mils) (4)
+- 3.0 mm (118 mils) (4)
+- 3.2 mm (126 mils) (4)
 
 Oval holes:
 
+- 0.5x0.9 mm (20x35 mils) (2)
+- 0.6x1.4 mm (24x55 mils) (2)
+- 0.6x1.7 mm (24x67 mils) (2)
 
 Drill tools (including vias and computing adjusts and rounding):
 
+- 0.6 mm (24 mils) (2)
+- 0.65 mm (26 mils) (2)
+- 0.7 mm (28 mils) (4)
+- 1.1 mm (43 mils) (10)
+- 1.7 mm (67 mils) (4)
+- 3.1 mm (122 mils) (4)
+- 3.2 mm (126 mils) (4)
 
 Solder paste stats:
 
@@ -84,7 +99,7 @@ The stencil thickness is  0.12 mm.
 
 | Side   | Pads with paste | Area [mm²] | Paste [g] |
 |--------|-----------------|------------|-----------|
-| Total  |               0 |       0.00 |      0.00 |
+| Total  |             224 |     283.71 |      1.41 |
 
 Note: this is just an approximation to the theoretical value. Margins of the solder mask and waste aren't computed.