Next generation of boards and cases

[revk]

I have been working on small changes to the PCB design, in part because of increasing failed production quality on boards, so several little changes, not just new power regulators, but board finish, and component placement and size, and pad sizes, and so on.

I have also been doing a lot of work on the auto generated 3D case designs, which now "snap" together nicely (FDM and resin printed). The case designs will also have a date code so you can check they match the board.

My next batch is likely to hit Amazon in a couple of months, and I may change colour to make the change extra obvious (OK, not, as costs more). I have also been battling with Amazon for some months on listing the new Generic S21 cable. My plan now is an S21 cable and 3D resin printed case in one as a product to accompany the Faikin, and list that on Amazon. I already have cable and resin printed cases on Tindie.

These also have additional test points including pads for USB connection separate to the TC2030 connector.

The new boards are not functionally better from a user point of view - so does not matter which you get.

This is more to just let your know I am continuing to develop this in all aspects.

[gurglingtonic]

Hello, I am planning to fabricate the PCB, but I was told that the small IC pad spacing is about 0.15 mm. If the spacing is less than 0.2mm, they cannot make a solder mask bridge around the small IC pad area. Appreciate for some advice.

[revk]

Odd, I have had no issues.

[revk]

Odd, I have had no issues.

[gurglingtonic]

Are you're able to fabricate 0.15mm with soldermask bridge?

Or is it okay if I go with their suggestion B, to accept no soldermask bridge between IC pads?

[revk]

I just order from JLC, sorry.

[revk]

I just order from JLC, sorry.