You signed in with another tab or window. Reload to refresh your session.You signed out in another tab or window. Reload to refresh your session.You switched accounts on another tab or window. Reload to refresh your session.Dismiss alert
@@ -75,48 +75,38 @@ Version | release | Release date | Comment
75
75
76
76
## Temperature characteristics
77
77
78
-
For higher currents especially in the range of 20-30Amps the board can get quite hot. Depending on the copper thickness of the PCB chosen when ordering the board the temperature can vary, as well as the cooling conditions. The board can be fitted with a heatsink to improve the thermal performance.
78
+
This board can measure the phase currents up to 30Amps, so it is intended to be used in applications that require current draw up to around 20Amps continuous. For higher currents especially in the range of 15-30Amps the board can get quite hot. Depending on the copper thickness of the PCB chosen when ordering the board the temperature can vary, as well as the cooling conditions. The board can be fitted with a heatsink to improve the thermal performance.
79
79
80
-
The following table shows the temperature rise of the board for different current levels. The measurements were done in a controlled environment with a constant ambient temperature of 25°C. The board was powered with 24V and the current was set to the desired level using the *Simple**FOC***library. The temperature was measured on the top of the board on the DRV8320H gate driver and the BSZ0904NSI mosfets. The temperature is measured with a PICOLOG TC-08 thermocouple data logger.
So I've wanted to quantify the temperature characteristics of the board when a continuous current is applied to the motor. The measurements were done with a relatively constant ambient temperature of around 25°C. The board was powered with 24V. The motor was run at very low speed (0.1rad/s) in the open loop and the current (q component) was set to 10, 15 and 20 amps for prolonged periods of time. I've measured the temperature on the top of the board on the DRV8320H gate driver and the BSZ0904NSI mosfets. I've used the PICOLOG TC-08 thermocouple data logger to do the measuring.
83
81
84
82
Two copper thicknesses were tested
85
83
1. Standard 4-layer:
86
84
-**1oz** (35um) copper thickness on top and bottom layers,
87
85
-**0.5oz** (17.5um) copper thickness on inner layers
Current [A] | Standard 4-layer MOSFETS | Thick 4-layer MOSFETS | Standard 4-layer DRV8320 | Thick 4-layer DRV8320
93
97
--- | --- | ---| --- | ---
94
98
10 | 57°C| 53°C | 50°C | 52°C
95
-
20 | 78°C | 68°C| 62°C | 62°C
96
-
30 | 125°C | 100°C | 82°C | 82°C
99
+
15 | 78°C | 68°C| 62°C | 62°C
100
+
20 | 125°C | 100°C | 82°C | 82°C
97
101
98
-
As the **BSZ0904NSI** mosfets are rated for temperatures up to 150°C and the **DRV8320H** gate driver up to 125°C the board can be used up to 30Amps without additional cooling.
99
-
100
-
**However, we strongly recommend using a heatsink or a thicker copper PCB (2oz top and bottom layers) for currents above 20Amps continuous.**
102
+
So the results seem to suggest that, as the **BSZ0904NSI** mosfets are rated for temperatures up to 150°C and the **DRV8320H** gate driver up to 125°C, the board can be used up to 20Amps without additional cooling.
101
103
104
+
**However, I would definitely recommend using a heatsink or a thicker copper PCB (2oz top and bottom layers) for currents above 15Amps continuous.**
102
105
103
106
104
107
<details>
105
-
<summary>Check more details about the experiment</summary>
106
-
107
-
108
-
### Measured temperatures during the experiment
108
+
<summary>Measured temperatures during the experiment</summary>
109
109
110
110
<imgsrc="images/experiment/temp_record.jpg" >
111
111
112
-
### Standard 4-layer PCB (1oz top and bottom, 0.5oz inner layers)
0 commit comments