Custom PCB design for the Arduino IoT Blinds Controller — a low-power, battery-operated ESP32 board that controls motorized window blinds via Arduino IoT Cloud.
┌─────────────────────────────────────────────────────────────┐
│ │
│ USB-C ──▶ BQ25886 ──▶ Battery ──▶ TPS62152 ──▶ 3.3V │
│ (charger) (buck) │
│ │
│ XIAO ESP32-C3 ◀──▶ BSS138 Level Shifters ──▶ Motor │
│ │ Driver │
│ │ │
│ └──▶ WiFi ──▶ Arduino IoT Cloud │
│ │
└─────────────────────────────────────────────────────────────┘
- Ultra-low power: Designed for battery operation with efficient power management
- USB-C charging: BQ25886 handles Li-Ion/Li-Po battery charging
- WiFi connectivity: ESP32-C3 connects to Arduino IoT Cloud
- Level shifting: BSS138 MOSFETs for interfacing with 5V motor drivers
- Compact: Uses Seeed XIAO module to minimize PCB size
- Tactile buttons: 4 switches for manual up/down control
hardware/
├── README.md # This file
├── gerber/ # PCB manufacturing files
│ ├── Gerber_*.G* # Copper, silkscreen, solder mask layers
│ ├── Drill_*.DRL # Drill files (PTH, NPTH, vias)
│ └── How-to-order-PCB.txt
└── docs/
└── BOM.md # Bill of Materials with LCSC part numbers
- Layers: 2
- Thickness: 1.6mm (standard)
- Surface finish: HASL or ENIG
- Minimum trace: Check Gerber for specifics
- Zip the contents of
/gerber/ - Upload to JLCPCB, PCBWay, or similar
- Select specs (2-layer, 1.6mm, green solder mask typical)
- Order! (Usually $2-5 for 5 boards)
All parts available from LCSC. See BOM.md for part numbers.
- Start with SMD components — Solder smallest parts first (0402 LEDs, 0603 passives)
- ICs next — BQ25886, TPS62152 (both QFN, need hot air or reflow)
- Through-hole last — Switches, USB connector
- XIAO module — Solder headers or direct-solder the module
- Soldering iron with fine tip
- Hot air station (for QFN packages) OR solder paste + reflow
- Flux
- Fine tweezers
- Magnification (loupe or microscope)
See the main project README for the bridge software. The ESP32 firmware that runs on this board connects to Arduino IoT Cloud — Arduino sketch coming soon in Phase 3.
Hardware designs released under CERN-OHL-P v2 (Permissive).