|
131 | 131 |
|
132 | 132 | (stroke (width 0) (type default)) (fill solid) (layer "F.Fab") (tstamp 9d771b0e-d7cd-4c89-964a-4e2bfb785e24))
|
133 | 133 | (pad "1" smd roundrect (at -1.905 2.8) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.15)
|
134 |
| - (solder_mask_margin 0.1016) (zone_connect 2) (thermal_bridge_angle 0) (tstamp 980a4866-ebfb-4a3f-a212-28eeed8959f6)) |
| 134 | + (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 980a4866-ebfb-4a3f-a212-28eeed8959f6)) |
135 | 135 | (pad "2" smd roundrect (at -0.635 2.8) (size 0.6 1.2) (layers "F.Cu") (roundrect_rratio 0.15)
|
136 | 136 | (chamfer_ratio 0) (chamfer top_left top_right)
|
137 | 137 | (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 1b1f8bb0-f23f-49df-ae8b-7aab19c088d4))
|
138 | 138 | (pad "3" smd roundrect (at 0.635 2.8) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.15)
|
139 |
| - (solder_mask_margin 0.1016) (zone_connect 2) (thermal_bridge_angle 0) (tstamp 71af5505-a3e8-4e6c-89a2-52f31cc1d990)) |
| 139 | + (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 71af5505-a3e8-4e6c-89a2-52f31cc1d990)) |
140 | 140 | (pad "4" smd roundrect (at 1.905 2.8) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.15)
|
141 |
| - (solder_mask_margin 0.1016) (zone_connect 2) (thermal_bridge_angle 0) (tstamp 3c178b1d-b2a8-4a33-b0f5-16cfa882cbd7)) |
| 141 | + (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 3c178b1d-b2a8-4a33-b0f5-16cfa882cbd7)) |
142 | 142 | (pad "5" smd roundrect (at 1.905 -2.8) (size 0.6 1.2) (layers "F.Cu") (roundrect_rratio 0.15)
|
143 | 143 | (chamfer_ratio 0) (chamfer bottom_left bottom_right)
|
144 | 144 | (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp a45fc4cd-6e6d-4511-824b-a37dd6e5db83))
|
145 | 145 | (pad "6" smd roundrect (at 0.635 -2.8) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.15)
|
146 |
| - (solder_mask_margin 0.1016) (zone_connect 2) (thermal_bridge_angle 0) (tstamp 1ded7123-518b-4b24-97be-5455d2c17d88)) |
| 146 | + (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 1ded7123-518b-4b24-97be-5455d2c17d88)) |
147 | 147 | (pad "7" smd roundrect (at -0.635 -2.8) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.15)
|
148 |
| - (solder_mask_margin 0.1016) (zone_connect 2) (thermal_bridge_angle 0) (tstamp 9dcdc513-1edd-4489-a3fa-a37ec607c89e)) |
| 148 | + (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 9dcdc513-1edd-4489-a3fa-a37ec607c89e)) |
149 | 149 | (pad "8" smd roundrect (at -1.905 -2.8) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.15)
|
150 | 150 | (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp cad02895-f7ca-4da5-944b-3c9d8fbc1a86))
|
151 | 151 | (pad "9" smd custom (at -0.635 1.74) (size 0.6 0.6) (layers "F.Cu")
|
|
0 commit comments