|
578 | 578 | (fp_line (start 8.89 16.51) (end 8.89 -16.51)
|
579 | 579 | (stroke (width 0.1524) (type solid)) (layer "F.Fab") (tstamp 55279f54-fc24-4968-a514-2c4000e3d91f))
|
580 | 580 | (pad "1" smd roundrect (at -8.89 -12.7) (size 2.54 1.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
581 |
| - (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 257ab559-36b5-4ab0-8b55-def4e5da1068)) |
| 581 | + (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 257ab559-36b5-4ab0-8b55-def4e5da1068)) |
582 | 582 | (pad "2" smd roundrect (at -8.89 -10.16) (size 2.54 1.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
583 |
| - (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp b670c041-3d79-4839-bffc-6b340217a3dd)) |
| 583 | + (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp b670c041-3d79-4839-bffc-6b340217a3dd)) |
584 | 584 | (pad "3" smd roundrect (at -8.89 -7.62) (size 2.54 1.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
585 |
| - (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp a905f428-e721-4ad1-a597-98bc09640e18)) |
| 585 | + (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp a905f428-e721-4ad1-a597-98bc09640e18)) |
586 | 586 | (pad "4" smd roundrect (at -8.89 -5.08) (size 2.54 1.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
587 |
| - (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 08bce9d6-c61e-41fb-a45b-1e0946f8be3a)) |
| 587 | + (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 08bce9d6-c61e-41fb-a45b-1e0946f8be3a)) |
588 | 588 | (pad "5" smd roundrect (at -8.89 -2.54) (size 2.54 1.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
589 |
| - (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 19c3ac90-fe17-4278-a5f0-c98a90f6991a)) |
| 589 | + (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 19c3ac90-fe17-4278-a5f0-c98a90f6991a)) |
590 | 590 | (pad "6" smd roundrect (at -8.89 0) (size 2.54 1.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
591 |
| - (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp a1ac9456-d6b4-4ef6-aab8-8f24dac15503)) |
| 591 | + (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp a1ac9456-d6b4-4ef6-aab8-8f24dac15503)) |
592 | 592 | (pad "7" smd roundrect (at -8.89 2.54) (size 2.54 1.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
593 |
| - (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp a71cc79c-34d6-4ed5-b300-d594ed85f0bc)) |
| 593 | + (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp a71cc79c-34d6-4ed5-b300-d594ed85f0bc)) |
594 | 594 | (pad "8" smd roundrect (at -8.89 5.08) (size 2.54 1.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
595 |
| - (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 1bb83a1e-bffc-4475-92ea-a2bf9513fe78)) |
| 595 | + (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 1bb83a1e-bffc-4475-92ea-a2bf9513fe78)) |
596 | 596 | (pad "9" smd roundrect (at -8.89 7.62) (size 2.54 1.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
597 |
| - (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 897251e2-5cd3-4100-a59a-22a95433d4a7)) |
| 597 | + (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 897251e2-5cd3-4100-a59a-22a95433d4a7)) |
598 | 598 | (pad "10" smd roundrect (at -8.89 10.16) (size 2.54 1.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
599 |
| - (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 419237a4-c707-44db-81e0-8a9ac3b69bf6)) |
| 599 | + (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 419237a4-c707-44db-81e0-8a9ac3b69bf6)) |
600 | 600 | (pad "11" smd roundrect (at -8.89 12.7) (size 2.54 1.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
601 |
| - (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 637ef639-68cb-4d68-b648-9df232233842)) |
| 601 | + (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 637ef639-68cb-4d68-b648-9df232233842)) |
602 | 602 | (pad "12" smd roundrect (at -8.89 15.24) (size 2.54 1.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
603 |
| - (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp f9af726d-c7fb-47e1-804a-8b499a0673d8)) |
| 603 | + (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp f9af726d-c7fb-47e1-804a-8b499a0673d8)) |
604 | 604 | (pad "13" smd roundrect (at 8.89 15.24) (size 2.54 1.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
605 |
| - (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp d2b96269-39c6-44b9-899a-c6281f0debfd)) |
| 605 | + (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp d2b96269-39c6-44b9-899a-c6281f0debfd)) |
606 | 606 | (pad "14" smd roundrect (at 8.89 12.7) (size 2.54 1.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
607 |
| - (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 9b2bcd31-7feb-40ea-a36f-5e8531e03513)) |
| 607 | + (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 9b2bcd31-7feb-40ea-a36f-5e8531e03513)) |
608 | 608 | (pad "15" smd roundrect (at 8.89 10.16) (size 2.54 1.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
609 |
| - (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp b7a9bd74-48af-4b03-a97e-3c067575f5a8)) |
| 609 | + (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp b7a9bd74-48af-4b03-a97e-3c067575f5a8)) |
610 | 610 | (pad "16" smd roundrect (at 8.89 7.62) (size 2.54 1.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
611 |
| - (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp f0aecb50-4369-49d5-8ad1-daae677c1e0a)) |
| 611 | + (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp f0aecb50-4369-49d5-8ad1-daae677c1e0a)) |
612 | 612 | (pad "17" smd roundrect (at 8.89 5.08) (size 2.54 1.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
613 |
| - (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 815edd89-8a23-4195-b705-e15386c07e73)) |
| 613 | + (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 815edd89-8a23-4195-b705-e15386c07e73)) |
614 | 614 | (pad "18" smd roundrect (at 8.89 2.54) (size 2.54 1.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
615 |
| - (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp f97cf075-4cc1-40c8-adf2-b64d51e206ca)) |
| 615 | + (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp f97cf075-4cc1-40c8-adf2-b64d51e206ca)) |
616 | 616 | (pad "19" smd roundrect (at 8.89 0) (size 2.54 1.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
617 |
| - (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 89d22253-33bd-437d-acd1-5e29bd3ba8a4)) |
| 617 | + (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 89d22253-33bd-437d-acd1-5e29bd3ba8a4)) |
618 | 618 | (pad "20" smd roundrect (at 8.89 -2.54) (size 2.54 1.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
619 |
| - (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 8aeee470-aa50-4238-a52c-02e8bb5b9906)) |
| 619 | + (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 8aeee470-aa50-4238-a52c-02e8bb5b9906)) |
620 | 620 | (pad "21" smd roundrect (at 8.89 -5.08) (size 2.54 1.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
621 |
| - (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 18b560a1-16bd-4d0b-8ded-01c64df943c7)) |
| 621 | + (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 18b560a1-16bd-4d0b-8ded-01c64df943c7)) |
622 | 622 | (pad "22" smd roundrect (at 8.89 -7.62) (size 2.54 1.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
623 |
| - (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 549aa3fb-6000-4a17-abbd-9e4a601c9802)) |
| 623 | + (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 549aa3fb-6000-4a17-abbd-9e4a601c9802)) |
624 | 624 | (pad "23" smd roundrect (at 8.89 -10.16) (size 2.54 1.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
625 |
| - (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 11157f55-e6a6-410f-ac8b-147af77edecf)) |
| 625 | + (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 11157f55-e6a6-410f-ac8b-147af77edecf)) |
626 | 626 | (pad "24" smd roundrect (at 8.89 -12.7) (size 2.54 1.27) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
627 |
| - (solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 383e9d40-b086-49b3-ae18-b27cc98289c8)) |
| 627 | + (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 383e9d40-b086-49b3-ae18-b27cc98289c8)) |
628 | 628 | )
|
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