Added LMH662[46], LMH6629, OPA356, OPA2356, OPA847 low noise amplifiers

[eto-]

SUMMARY

Added LMH662[46], LMH6629, OPA356, OPA2356, OPA847 low noise amplifiers
Added component for LMH6629

DATASHEETS / REFERENCES

https://www.ti.com/lit/ds/symlink/opa356.pdf
https://www.ti.com/lit/ds/symlink/lmh6624.pdf
https://www.ti.com/lit/ds/symlink/lmh6629.pdf
https://www.ti.com/lit/ds/symlink/opa847.pdf

OPEN QUESTIONS / UNRESOLVED ISSUES

CHECKLIST

• I have read and followed the library conventions¹.
• For packages, I followed IPC7351C (see details in library conventions).
• For modified elements, I bumped their version number².
• I already used the new library elements in a design and verified their correctness (optional).
• I'm the copyright owner of the added content (i.e. the changes are made by myself, not copied/imported from somewhere else).
• I agree to publish all my changes under the CC0 Public Domain License³, allowing everyone to use and modify the content without any restrictions.

¹ Library Conventions: https://docs.librepcb.org/#libraryconventions
² Minor version bump if only metadata was modified (e.g. "0.1" -> "0.1.1"), major version bump if functional changes were made (e.g. "0.1" -> "0.2")
³ CC0 Public Domain License: https://en.wikipedia.org/wiki/CC0

[eto-]

Is there any news on this? I have new packages and devices coming and I would prefer to have these checked before I submit a second PR.

[ubruhin]

Sorry for missing this PR :-/

I reviewed now. Pinouts etc look good, but I applied a few changes:

• Remove new component which was not used by any device
• Renamed devices to reflect the MPN more accurately (e.g. "TI LMH6626-SO8" -> "TI LMH6626MA")
• Make sure MPNs are complete (e.g. "LMH6626MA" -> "LMH6626MA/NOPB")
• Add all remaining MPNs according datasheets
• Specify packaging variant in part attributes (to distinguish parts)
• Add datasheet URLs
• Rebased branch

I hope that's fine for you. For new devices it would be nice to apply these things too :)

[eto-]

OK for everything.
I will respect the same standards for future devices.

The unused component is for LMH6629 with WSON package: I did not commit it to begin with because on the 3D model.
For several TI devices I prepared a WSON/WQFN10 step file with freecad and they are GPL: but when importing in Librepcb the models becomes transparent.