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Add TPC v5.0 for SDSP converter v3.18#1640

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kawakami-masaki0 merged 2 commits intoSonySemiconductorSolutions:feature_tpc_improvement2from
kawakami-masaki0:feature_add_tpc_for_sdsp_v318
Jan 21, 2026
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Add TPC v5.0 for SDSP converter v3.18#1640
kawakami-masaki0 merged 2 commits intoSonySemiconductorSolutions:feature_tpc_improvement2from
kawakami-masaki0:feature_add_tpc_for_sdsp_v318

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Pull Request Description:

Add TPC v5.0 for SDSP converter v3.18

Checklist before requesting a review:

  • I set the appropriate labels on the pull request.
  • I have added/updated the release note draft (if necessary).
  • I have updated the documentation to reflect my changes (if necessary).
  • All function and files are well documented.
  • All function and classes have type hints.
  • There is a licenses in all file.
  • The function and variable names are informative.
  • I have checked for code duplications.
  • I have added new unittest (if necessary).

@kawakami-masaki0 kawakami-masaki0 merged commit 47b3b7e into SonySemiconductorSolutions:feature_tpc_improvement2 Jan 21, 2026
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@kawakami-masaki0 kawakami-masaki0 deleted the feature_add_tpc_for_sdsp_v318 branch January 21, 2026 05:53
ueno-hiroshi002 added a commit that referenced this pull request Feb 2, 2026
Remaining work on PR #1635
* TPC Improvement
  * Add TPC v5.0 for SDSP converter v3.18 (#1640)
  * Change get_target_platform_capabilities API in tutorials. (#1637, #1638)
  * Modify links in README for TPC (#1641)
    * Since there was a link to a previously unpublished page, we temporarily used a relative path in #1622. It has now been reverted to the official link.
* Fix for missing parameter specifications in MCTWrapper. (#1642)
* Change implementation of wrapper for TPC Improvement.
  * Maintenance Tutorials of MCTWrapper (#1639)
  * Update and Maintenance API Documents of MCTWrapper (#1644)
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3 participants