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Update home etching template DRC rules and dimensions
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3 files changed

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templates/home-etch-photoresist/README.md

Lines changed: 7 additions & 7 deletions
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@@ -35,13 +35,13 @@ The template is preconfigured as a 2-layer board with constraints appropriate fo
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| Parameter | Value | Notes |
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| --------------------------- | ------- | ---------------------------------------- |
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| Minimum clearance | 0.2 mm | Safe for photoresist resolution |
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| Minimum track width | 0.25 mm | Reliable with standard UV exposure |
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| Minimum track width | 0.3 mm | Reliable with standard UV exposure |
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| Minimum connection width | 0.25 mm | Ensures good electrical connection |
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| Minimum annular width | 0.15 mm | Adequate for manual drilling tolerance |
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| Minimum via diameter | 0.6 mm | Suitable for 0.3 mm drill bits |
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| Minimum annular width | 0.25 mm | Adequate for manual drilling tolerance |
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| Minimum via diameter | 0.8 mm | Suitable for 0.3 mm drill bits |
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| Copper to hole clearance | 0.3 mm | Accounts for drilling precision |
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| Copper to edge clearance | 0.5 mm | Safe margin for cutting/routing |
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| Minimum through hole | 0.6 mm | Standard drill bit availability |
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| Minimum through hole | 0.3 mm | Standard drill bit availability |
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| Hole to hole clearance | 0.3 mm | Prevents drill breakage |
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| Min text height | 0.8 mm | Readable after etching process |
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| Min text thickness | 0.08 mm | Maintains legibility |
@@ -53,8 +53,8 @@ The template is preconfigured as a 2-layer board with constraints appropriate fo
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| Property | Value |
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| -------------- | ------- |
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| Clearance | 0.2 mm |
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| Track Width | 0.25 mm |
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| Via Size | 0.6 mm |
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| Track Width | 0.3 mm |
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| Via Size | 0.8 mm |
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| Via Hole | 0.3 mm |
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| DiffPair Width | 0.2 mm |
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| DiffPair Gap | 0.25 mm |
@@ -73,7 +73,7 @@ The template is preconfigured as a 2-layer board with constraints appropriate fo
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## Notes
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* No solder mask or silkscreen layers configured — add if needed for your process
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* No solder mask or silkscreen layers configured — silkscreen errors are ignored as this layer is not used in home etching
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* Conservative design rules prioritize manufacturing success over density
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* Test your specific photoresist/exposure setup with simple test patterns first
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* Consider tinning traces after etching to prevent oxidation

templates/home-etch-photoresist/home-etch-photoresist.kicad_pro

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@@ -91,24 +91,24 @@
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"lib_footprint_mismatch": "warning",
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"malformed_courtyard": "error",
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"microvia_drill_out_of_range": "error",
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"mirrored_text_on_front_layer": "warning",
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"mirrored_text_on_front_layer": "ignore",
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"missing_courtyard": "ignore",
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"missing_footprint": "warning",
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"net_conflict": "warning",
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"nonmirrored_text_on_back_layer": "warning",
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"nonmirrored_text_on_back_layer": "ignore",
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"npth_inside_courtyard": "ignore",
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"padstack": "warning",
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"pth_inside_courtyard": "ignore",
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"shorting_items": "error",
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"silk_edge_clearance": "warning",
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"silk_over_copper": "warning",
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"silk_overlap": "warning",
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"silk_edge_clearance": "ignore",
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"silk_over_copper": "ignore",
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"silk_overlap": "ignore",
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"skew_out_of_range": "error",
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"solder_mask_bridge": "error",
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"starved_thermal": "error",
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"text_height": "warning",
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"text_height": "ignore",
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"text_on_edge_cuts": "error",
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"text_thickness": "warning",
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"text_thickness": "ignore",
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"through_hole_pad_without_hole": "error",
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"too_many_vias": "error",
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"track_angle": "error",
@@ -136,9 +136,9 @@
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"min_text_height": 0.8,
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"min_text_thickness": 0.08,
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"min_through_hole_diameter": 0.3,
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"min_track_width": 0.25,
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"min_via_annular_width": 0.15,
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"min_via_diameter": 0.6,
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"min_track_width": 0.3,
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"min_via_annular_width": 0.25,
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"min_via_diameter": 0.8,
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"solder_mask_to_copper_clearance": 0.0,
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"use_height_for_length_calcs": true
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},
@@ -481,8 +481,8 @@
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"pcb_color": "rgba(0, 0, 0, 0.000)",
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"priority": 2147483647,
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"schematic_color": "rgba(0, 0, 0, 0.000)",
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"track_width": 0.25,
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"via_diameter": 0.6,
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"track_width": 0.3,
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"via_diameter": 0.8,
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"via_drill": 0.3,
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"wire_width": 6
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}
@@ -492,7 +492,12 @@
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},
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"net_colors": null,
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"netclass_assignments": null,
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"netclass_patterns": []
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"netclass_patterns": [
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{
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"netclass": "Default",
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"pattern": "*"
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}
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]
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},
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"pcbnew": {
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"last_paths": {

templates/home-etch-photoresist/meta/info.html

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@@ -94,7 +94,7 @@ <h2>Design Rules → Constraints</h2>
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</tr>
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<tr>
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<td>Minimum track width</td>
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<td>0.25 mm</td>
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<td>0.3 mm</td>
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<td>Reliable with standard UV exposure</td>
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</tr>
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<tr>
@@ -104,12 +104,12 @@ <h2>Design Rules → Constraints</h2>
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</tr>
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<tr>
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<td>Minimum annular width</td>
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<td>0.15 mm</td>
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<td>0.25 mm</td>
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<td>Adequate for manual drilling tolerance</td>
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</tr>
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<tr>
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<td>Minimum via diameter</td>
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<td>0.6 mm</td>
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<td>0.8 mm</td>
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<td>Suitable for 0.3 mm drill bits</td>
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</tr>
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<tr>
@@ -124,7 +124,7 @@ <h2>Design Rules → Constraints</h2>
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</tr>
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<tr>
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<td>Minimum through hole</td>
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<td>0.6 mm</td>
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<td>0.3 mm</td>
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<td>Standard drill bit availability</td>
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</tr>
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<tr>
@@ -156,11 +156,11 @@ <h2>Net Classes → <code>Default</code></h2>
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</tr>
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<tr>
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<td>Track Width</td>
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<td>0.25 mm</td>
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<td>0.3 mm</td>
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</tr>
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<tr>
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<td>Via Size</td>
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<td>0.6 mm</td>
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<td>0.8 mm</td>
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</tr>
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<tr>
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<td>Via Hole</td>
@@ -203,8 +203,8 @@ <h2>Manufacturing Process Compatibility</h2>
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<h2>Notes</h2>
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<ul>
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<li>
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No solder mask or silkscreen layers configured — add if needed
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for your process
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No solder mask or silkscreen layers configured — silkscreen
207+
errors are ignored as this layer is not used in home etching
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</li>
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<li>
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Conservative design rules prioritize manufacturing success over

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