Merge pull request #55 from sparkfun/BP2G1+_Improvements

Update BP2G1+ Bypass1/2 footprints - no more errors or warnings!

Author: nseidle

Footprints/SparkFun-Jumper.pretty/BypassJumper_SOIC_NoPaste.kicad_mod

@@ -108,19 +108,19 @@
 
     (stroke (width 0) (type default)) (fill solid) (layer "F.Fab") (tstamp 9d771b0e-d7cd-4c89-964a-4e2bfb785e24))
   (pad "1" smd roundrect (at -1.905 2.8) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.15)
-    (solder_mask_margin 0.1016) (zone_connect 2) (thermal_bridge_angle 0) (tstamp 980a4866-ebfb-4a3f-a212-28eeed8959f6))
+    (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 980a4866-ebfb-4a3f-a212-28eeed8959f6))
   (pad "2" smd roundrect (at -0.635 2.8) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.15)
     (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 1b1f8bb0-f23f-49df-ae8b-7aab19c088d4))
   (pad "3" smd roundrect (at 0.635 2.8) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.15)
-    (solder_mask_margin 0.1016) (zone_connect 2) (thermal_bridge_angle 0) (tstamp 71af5505-a3e8-4e6c-89a2-52f31cc1d990))
+    (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 71af5505-a3e8-4e6c-89a2-52f31cc1d990))
   (pad "4" smd roundrect (at 1.905 2.8) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.15)
-    (solder_mask_margin 0.1016) (zone_connect 2) (thermal_bridge_angle 0) (tstamp 3c178b1d-b2a8-4a33-b0f5-16cfa882cbd7))
+    (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 3c178b1d-b2a8-4a33-b0f5-16cfa882cbd7))
   (pad "5" smd roundrect (at 1.905 -2.8) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.15)
     (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp a45fc4cd-6e6d-4511-824b-a37dd6e5db83))
   (pad "6" smd roundrect (at 0.635 -2.8) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.15)
-    (solder_mask_margin 0.1016) (zone_connect 2) (thermal_bridge_angle 0) (tstamp 1ded7123-518b-4b24-97be-5455d2c17d88))
+    (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 1ded7123-518b-4b24-97be-5455d2c17d88))
   (pad "7" smd roundrect (at -0.635 -2.8) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.15)
-    (solder_mask_margin 0.1016) (zone_connect 2) (thermal_bridge_angle 0) (tstamp 9dcdc513-1edd-4489-a3fa-a37ec607c89e))
+    (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 9dcdc513-1edd-4489-a3fa-a37ec607c89e))
   (pad "8" smd roundrect (at -1.905 -2.8) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.15)
     (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp cad02895-f7ca-4da5-944b-3c9d8fbc1a86))
 )

Footprints/SparkFun-Jumper.pretty/BypassJumper_SOIC_Paste.kicad_mod

@@ -1,6 +1,7 @@
 (footprint "BP2G1+_Bypass1" (version 20221018) (generator pcbnew)
   (layer "F.Cu")
-  (descr "Mechanical Specifications: Pad Size: .76mm x 1.27mm; Pin count: 8; Pin pitch: 1.27mm; Package Size: 5.33mm x 4.14mm. Reduced paste on input and output pins.")
+  (descr "SOIC8 footprint modified for the BP2G1+ power divider; includes bypass jumper; reduced paste to compensate.")
+  (attr allow_soldermask_bridges)
   (fp_text reference "REF**" (at -3.175 0 90) (layer "F.Fab")
       (effects (font (size 0.5 0.5) (thickness 0.1) bold) (justify bottom))
     (tstamp e1490cd2-0107-4bb9-88c2-b2c3b64df681)
@@ -9,36 +10,6 @@
       (effects (font (size 0.48768 0.48768) (thickness 0.12192)) (justify bottom))
     (tstamp 799caed2-1237-499e-b742-47218d2e0fcf)
   )
-  (fp_line (start -1.905 -1.5875) (end -1.905 -0.635)
-    (stroke (width 0.3302) (type default)) (layer "F.Cu") (tstamp c9ed9be8-8ca4-4944-92e5-941158c4426d))
-  (fp_line (start -0.635 0.635) (end -0.635 1.5875)
-    (stroke (width 0.3302) (type default)) (layer "F.Cu") (tstamp a23fd736-166d-487a-8704-3629a03119a7))
-  (fp_arc (start -1.27 0) (mid -1.719012 -0.185987) (end -1.905 -0.635)
-    (stroke (width 0.3302) (type default)) (layer "F.Cu") (tstamp 7d397d3b-61e8-49cd-b4c7-64840603ac2e))
-  (fp_arc (start -1.27 0) (mid -0.820988 0.185987) (end -0.635 0.635)
-    (stroke (width 0.3302) (type default)) (layer "F.Cu") (tstamp 1cb8364a-0a96-47b7-a60d-8d763ca65843))
-  (fp_poly
-    (pts
-      (xy -1.651 -1.982)
-      (xy -2.159 -1.982)
-      (xy -2.159 -1.6764)
-      (xy -2.03 -1.5)
-      (xy -1.778 -1.4986)
-      (xy -1.651 -1.6764)
-    )
-
-    (stroke (width 0.1) (type solid)) (fill solid) (layer "F.Cu") (tstamp f9cad05c-f17b-4c3f-b696-b75b86dba804))
-  (fp_poly
-    (pts
-      (xy -0.889 1.982)
-      (xy -0.381 1.982)
-      (xy -0.381 1.6764)
-      (xy -0.5 1.4986)
-      (xy -0.762 1.4986)
-      (xy -0.889 1.6764)
-    )
-
-    (stroke (width 0.1) (type solid)) (fill solid) (layer "F.Cu") (tstamp 617f21ca-da56-425f-bb59-bff5fbac2002))
   (fp_poly
     (pts
       (xy -2.2 -2.4)
@@ -63,9 +34,9 @@
     (stroke (width 0.2032) (type solid)) (layer "F.SilkS") (tstamp 30166348-2ff2-46c0-ab91-3fe5acdc64ab))
   (fp_circle (center -3.048 2.794) (end -2.794 2.794)
     (stroke (width 0.05) (type solid)) (fill solid) (layer "F.SilkS") (tstamp 0901a7a7-cb8f-4e5c-92b6-ecf0fd0e2f44))
-  (fp_rect (start -1.5748 -1.4224) (end -2.2352 -3.4544)
+  (fp_rect (start -1.5748 -3.4498) (end -2.2352 -1.3544)
     (stroke (width 0.1) (type solid)) (fill solid) (layer "F.Mask") (tstamp b4f7651a-9296-4f18-ba6f-08d305b664e8))
-  (fp_rect (start -0.9652 1.4224) (end -0.3048 3.4544)
+  (fp_rect (start -0.9652 1.3624) (end -0.3048 3.4544)
     (stroke (width 0.1) (type solid)) (fill solid) (layer "F.Mask") (tstamp 1dd34cde-10fe-4bd7-90f0-84ae4d1b16e5))
   (fp_rect (start -2.794 -3.556) (end 2.794 3.556)
     (stroke (width 0.05) (type default)) (fill none) (layer "F.CrtYd") (tstamp 688dcf9b-a357-40df-bcce-06d06e7d0a2f))
@@ -160,19 +131,58 @@
 
     (stroke (width 0) (type default)) (fill solid) (layer "F.Fab") (tstamp 9d771b0e-d7cd-4c89-964a-4e2bfb785e24))
   (pad "1" smd roundrect (at -1.905 2.8) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.15)
-    (solder_mask_margin 0.1016) (zone_connect 2) (thermal_bridge_angle 0) (tstamp 980a4866-ebfb-4a3f-a212-28eeed8959f6))
+    (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 980a4866-ebfb-4a3f-a212-28eeed8959f6))
   (pad "2" smd roundrect (at -0.635 2.8) (size 0.6 1.2) (layers "F.Cu") (roundrect_rratio 0.15)
+    (chamfer_ratio 0) (chamfer top_left top_right)
     (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 1b1f8bb0-f23f-49df-ae8b-7aab19c088d4))
   (pad "3" smd roundrect (at 0.635 2.8) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.15)
-    (solder_mask_margin 0.1016) (zone_connect 2) (thermal_bridge_angle 0) (tstamp 71af5505-a3e8-4e6c-89a2-52f31cc1d990))
+    (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 71af5505-a3e8-4e6c-89a2-52f31cc1d990))
   (pad "4" smd roundrect (at 1.905 2.8) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.15)
-    (solder_mask_margin 0.1016) (zone_connect 2) (thermal_bridge_angle 0) (tstamp 3c178b1d-b2a8-4a33-b0f5-16cfa882cbd7))
+    (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 3c178b1d-b2a8-4a33-b0f5-16cfa882cbd7))
   (pad "5" smd roundrect (at 1.905 -2.8) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.15)
     (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp a45fc4cd-6e6d-4511-824b-a37dd6e5db83))
   (pad "6" smd roundrect (at 0.635 -2.8) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.15)
-    (solder_mask_margin 0.1016) (zone_connect 2) (thermal_bridge_angle 0) (tstamp 1ded7123-518b-4b24-97be-5455d2c17d88))
+    (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 1ded7123-518b-4b24-97be-5455d2c17d88))
   (pad "7" smd roundrect (at -0.635 -2.8) (size 0.6 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.15)
-    (solder_mask_margin 0.1016) (zone_connect 2) (thermal_bridge_angle 0) (tstamp 9dcdc513-1edd-4489-a3fa-a37ec607c89e))
+    (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 9dcdc513-1edd-4489-a3fa-a37ec607c89e))
   (pad "8" smd roundrect (at -1.905 -2.8) (size 0.6 1.2) (layers "F.Cu") (roundrect_rratio 0.15)
+    (chamfer_ratio 0) (chamfer bottom_left bottom_right)
     (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp cad02895-f7ca-4da5-944b-3c9d8fbc1a86))
+  (pad "9" smd custom (at -0.635 1.74) (size 0.6 0.6) (layers "F.Cu")
+    (solder_mask_margin 0.1016) (zone_connect 0) (thermal_bridge_angle 0)
+    (options (clearance outline) (anchor rect))
+    (primitives
+      (gr_poly
+        (pts
+          (xy -0.3 -0.2)
+          (xy 0.3 -0.2)
+          (xy 0.3 -0.3)
+          (xy 0.1 -0.5)
+          (xy -0.1 -0.5)
+          (xy -0.3 -0.3)
+        )
+        (width 0) (fill yes))
+      (gr_line (start 0 -0.33) (end 0 -1.105) (width 0.33))
+      (gr_arc (start -0.635 -1.74) (mid -0.185987 -1.554013) (end 0 -1.105) (width 0.33))
+      (gr_arc (start -0.635 -1.74) (mid -1.084013 -1.925987) (end -1.27 -2.375) (width 0.33))
+      (gr_line (start -1.27 -2.375) (end -1.27 -3.15) (width 0.33))
+      (gr_poly
+        (pts
+          (xy -0.97 -3.28)
+          (xy -1.57 -3.28)
+          (xy -1.57 -3.18)
+          (xy -1.37 -2.98)
+          (xy -1.17 -2.98)
+          (xy -0.97 -3.18)
+        )
+        (width 0) (fill yes))
+      (gr_poly
+        (pts
+          (xy -1.57 -3.18)
+          (xy -0.97 -3.18)
+          (xy -0.97 -3.78)
+          (xy -1.57 -3.78)
+        )
+        (width 0) (fill yes))
+    ) (tstamp 404ee80d-d1e3-4835-8e5c-a41b52bc9c6a))
 )