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openroad: rework floorplan and padring#93

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phsauter merged 1 commit intomainfrom
phsauter/padring
Dec 12, 2025
Merged

openroad: rework floorplan and padring#93
phsauter merged 1 commit intomainfrom
phsauter/padring

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@phsauter phsauter commented Dec 9, 2025

Addresses #87

  • move die size def to floorplan.tcl
  • move bondpads into OpenROAD die area

- move die size def to floorplan.tcl
- move bondpads into OpenROAD die area
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I verified the bondpad locations and die size by manual inspection and they match the intent.
The die size is 1930x1930μm (assuming a 35μm sealring this brings us to 2000μm).
The bondpads have a pitch of 90μm with 290μm from the center of the last pads to the edge of the die.

@phsauter phsauter merged commit 7a08cfe into main Dec 12, 2025
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@phsauter phsauter deleted the phsauter/padring branch December 12, 2025 10:10
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