QIVICON Home Base 2

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J. Neuschäfer edited this page Feb 14, 2026 · 5 revisions

photo of the device

The QIVICON Home Base 2 was sold by Telekom in Germany, and developed by Huawei.

(Photo from digitalzimmer.de)

Internals

bottom of PCB photo

top of PCB photo

Chips:

HiSilicon SD5650T V110 SoC
Winbond W25Q80: 1 MiB QSPI flash
Micron 29F4G: 512 MiB NAND flash
Samsung K4B4G1646D-BCK0: 512 MiB DDR3 RAM
Silicon Labs EM3587: ZigBee/802.15.4
RTL8192: 802b/g/n USB WLAN
RTL8761: Bluetooth controller
Microchip/SMSC USB2514: USB 2.0 4-port hub
P24JPVSK: unknown chip manufactured by ST
HM-MOD-UART-AW-SH-2: Homematic module

Pinout

close-up of SoC, with pin numbers

The SD5650T V110 comes in a LQFP256 package.

Pin 10/11: ??
Pin 13/14, 16/17: Ethernet (two diffpairs)
Pin 93/94: some kind of signal @ 3.3V, 12 MHz sample rate, continually transmitting
Pin 177/178: USB?

Future research

Reading the NAND flash
Patching the bootloader to use the UART that is currently connected to the Homematic module

References